Thursday, March 20, 2014:
Bench-top soldering solutions
In February 2014, PCB Power launched an SMD reflow oven and SMD solder paste stencil printer. The bench-top SMD reflow oven can have unlimited user-defined soldering profiles, with a simple reflow-pilot PC software that comes with it. The microprocessor control on the oven stores up to five profiles, and features a separate temperature on the PCB to simulate live profile simulations. It can also handle both leaded and unleaded solder, which is heated through Quartz IR and ducted forced hot air. The SMD solder paste stencil printer is an economical printer that is sufficiently fast and precise. It uses inexpensive laser-cut stainless steel stencils, and features excellent registration repeatability. No clamping holes are needed to support the stencil. Both the equipment can handle a maximum PCB size of 350×250 mm.
For further details: Ph: 91-79-2528-7086/87, [email protected], www.pcbpower.com
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Soldering and de-soldering station
In January 2014, Srinivasa Electronics introduced a soldering and de-soldering station called PLUTO 777. The station offers an input voltage range of 190 V to 270 V, an output voltage of 24V AC, soldering wattage of 60 W, de-soldering wattage of 70 W, and a temperature range between 180 to 480 degrees Celsius. The system includes a control unit, soldering iron handle, de-soldering iron handle, tool box, cleaning sponge and a combined stand. It also comes with a high quality 12/24V DC pump with 4000 RPM.
For further details: Ph: 91-9618231000, [email protected], www.plutostations.com
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SMT assembler with integrated jet printer
In March 2014, Essemtec launched an SMT assembler with an integrated solder paste jet printer. The company claims it is the first manufacturer in the world to develop a combined SMT production centre that is able to jet solder paste and mount components in one machine. The solder jet printer is fast (up to 80,000 dots/hr), very precise (51µm @3σ) and suitable for 0201 components. Jetting of solder paste instead of printing saves costs for stencils, eliminates printing errors and enhances production flexibility, especially for lower to mid-sized volumes.
For further details: Ph: 91-9880 795 227, [email protected], www.essemtec.com
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Placement machine
In January 2014, SIPLACE launched a placement machine, the SIPLACE X4i S, which sets a new record with a rating of 150,000 CPH. Unique interchangeable gantries, new options and software modules for accelerated NPI processes and innovative set-up changeover concepts further enhance the product in terms of flexibility and scalability. The SIPLACE CA combines flip chip, die attach and SMT processes in a single machine and operates with an accuracy of 10µm at 3 Sigma (MAC test). The new launch also features SIPLACE’s interchangeable gantries, giving manufacturers new options in responding to changing demand levels.
For further details: Ph: 65-6866-7030, [email protected], www.siplace.com
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Electronics Bazaar, South Asia’s No.1 Electronics B2B magazine
