Monday, December 16, 2013:
Multi-purpose automated fabrication machine
In October 2013, Fuji launched the SmartFAB, a modular multi-purpose automated fabrication machine that automates manual assembly work to save labour and achieve high productivity as well as high quality. SmartFAB supports various forms of parts such as radial parts, axial parts, trays, sticks and bowl feeders, and has the ability to handle part sizes from 1608 mm (0603 inch) to 190×190 mm, with heights that go up to 110 mm and weights of up to 200 g. The machine is equipped with various standard nozzles and chucks to handle components during production. It is also capable of connection processes such as adhesive dispensing, bolt tightening, and spot flow soldering.
For further details: Ph: +81-566-81-8294; http://nfa.fuji.co.jp/e/
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3D SPI system
In October 2013, GOEPEL Electronics launched an integrated system software, called SPI-Pilot 1.4, with optimised 3D calculations and numerous additional highlights. Solder paste inspection (SPI)-Pilot 1.4 offers enhanced algorithms for measured value determination, i.e., the OptiCon SPI-Line 3D system provides measurement data on the volume, offset and height of the solder deposit in an even more reliable way. It also includes an extended module for statistical process control (SPC) and real-time monitoring of the printing process. Easy-to-use controls and a well-organised display allow for the SPC module to be also used by a tablet PC with touch capability. The new verification and classification station software enables very simple and efficient evaluation of test results.
For further details: Ph: +49-3641-6896-739; [email protected], www.goepel.com
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Electronics Bazaar, South Asia’s No.1 Electronics B2B magazine