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Chemicals & consumables: New products

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Tuesday, May 12, 2013: 

PoP solder paste

In March 2013, Indium Corporation launched Indium9.91, which is a no-clean solder paste designed for use in package-on-package (PoP) applications that are 0.3mm and larger. Its rheology optimises both dipping and package retention. Its key features include the elimination of defects due to package warping, excellent solderability, and consistent solder paste volumes. Indium9.91 can be used with SAC305 and Sn63/Pb37 alloys.

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For further details: Ph: +65 6268 8678, [email protected], www.indium.com

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