Tuesday, October 15, 2013:
Nano-silver paste
In August 2013, Nihon Superior (Singapore) Pte Ltd launched alcohol-passivated nano-silver paste for the electronics assembly process. Alconano nano-silver paste is based on a patented technology that makes it possible to effect joints to most metals as well as Si and SiC (silicon and silicon carbide) at low sintering temperatures. This can be done, if necessary, in nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of some other nano-silver pastes. The highly active surface of the nano-silver particles, and the consequent strong capillary forces, makes it possible to achieve strong bonds with high electrical and thermal conductivity at low temperatures, without the need for external pressure.
For further details: Ph: +65 67414633, [email protected], www.nihonsuperior.co.jp
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Cleaners for SMT stencils
In August 2013, Zestron launched the VIGON UC 160, the new generation of underside cleaners for SMT stencils. This is a single-phase cleaning agent specifically designed for underside wipe processes in SMT printers. It offers improved cleaning performance compared to conventional media and has the following advantages: effective wetting of the cleaning paper and therefore a better cleaning performance; removal of solder paste even from fine-pitch apertures; ideal for printing after a pause; less consumption due to lower dosage volume/times; quick wet-cleaning cycles can be run; high health and work safety, therefore an ideal substitute for isopropanol.
For further details: Mectronics Marketing Services (India distributor), [email protected], www.mectronics.in
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Electronics Bazaar, South Asia’s No.1 Electronics B2B magazine
