Wednesday, August 14, 2013: Over the years, automated optical inspection (AOI) systems and solder paste inspection (SPI) systems have become essential tools in PCB assembly lines, particularly in industries where tough quality and safety standards apply. It is not just the increasing board density and the miniaturisation of components that are driving this trend—the use of AOI and SPI systems in the overall process control and test strategy has proved to be an unmatched return on investment. Over the years, makers of these machines have technically enhanced the features in order to meet all the challenges of today’s complex PCB assembly.
Model: SE600 SPI system, Brand: CyberOptics, Manufacturer: CyberOptics Corporation, USA
Launched in July 2013, SE600, which is CyberOptics’ flagship SPI system, is the most advanced, high performance solution. It brings together accuracy and world-class usability on a single platform, making it the ideal inspection solution for automotive, medical, military and other niche markets. SE600 comes with a standard dual illumination sensor designed to offer the best repeatability and reproducibility, even on the very smallest of paste deposits. The award-winning SPIv5.0 software on SE600 offers touchscreen capabilities and a world class user experience for easy, flawless inspection. The newly-designed software includes multi-touch, easy pan, zoom in and out, multi-selection, unlimited undo-redo options, and much more to enable simplified operations and quick programming.
Key features
- Standard dual illumination sensor
- Best-in-class accuracy and repeatability
- World-class user experience with award-winning newly designed software
- Panel size capacity (max): 510 x 510 mm; min: 50 x 50 mm
Contact details: Dennis Rutherford, VP, sales and marketing, Ph: +65-9632-4695, [email protected], www.cyberoptics.com
India distributor: Maxim SMT Technologies Pvt Ltd
________________________________________________________________________________________
Model: 4000Plus Bond Tester Pad Cratering Inspection System, Brand: Nordson DAGE, Manufacturer: Nordson DAGE, UK
Launched in June 2013, this inspection system has a unique patented technique to test probe solder bumps or solder paste in order to perform a hot bump pull test in full accordance with IPC-9708 test standards for the detection of pad cratering in surface mount and printed circuit board assemblies. Pad cratering has become a major issue with lead-free assemblies, and the development of the IPC-9708 standard together with the availability of the 4000Plus hot bump pull test methodology enables product developers to determine the optimum materials for their applications.
Key features
- A fully integrated single load cartridge, with heating, cooling and pin clamping mechanisms
- Hot bump pull application is achieved by selecting a specialised load cartridge, which can be programmed to apply a time-temperature reflow profile to individual solder bumps and/or bonds using a test probe
- A selection of standard probe sizes as well as custom test tips are offered, and are available upon request
Contact details: Alan King, global sales director, Bond Tester Products, Ph: +44-1296-317898, mobile: +44-7802283385, [email protected], www.nordsondage.com
India distributor: International Marketing Corporation
________________________________________________________________________________________
Model: MS-15 3D Inline 3D SPI system, Brand: Mirtec, Manufacturer: Mirtec, Korea
Launched in March 2013, this award winning system can handle precise volumes and take care of shadow problems. The precise laser PCB Warpage Compensation helps to measure error free volumatric measurement of solder paste. It can not only measure the exact height of PCBs with lasers but also automatically measure real PCB winding. It can even precisely measure the volume of solder paste.
Key features
- High-speed precision in-line SPI systems
- Exclusive 15MP digital camera technology
- Precision telecentric compound lens design
- 10 micron/pixel resolution
- 2 micron height accuracy
- Volume repeatability ±2 per cent
- Extremely simple programming and operation
Contact details: David Bennett, president, global sales, Ph: +44-0-1752-696-695, [email protected], www.mirtec.com
India distributor: Accurex Solutions Pvt Ltd
________________________________________________________________________________________
Model: VT-RNS2, Brand: Omron, Manufacturer: Omron Co Ltd, Japan
Upgraded in January 2013, VT-RNS2 is a fully automatic optical inspection system based on the most reliable algorithm inspection method. The VT RNS2 model can be easily configured to perform three different types of printed circuit board inspections, making VT RNS a very flexible machine that can be used to inspect PCBs at the post paste, post placement or post solder stages.
Key features
- Algorithm-based inspection technique, true colour image processing, RGB colour highlight technology and fast inspection periods
- Can handle PCB sizes of up to 510 x 460 mm, very reliable solder defect detection, guaranteed low false calls
- High-resolution 3-CCD camera method for higher accuracy
- Patented three-colour highlight AOI technology
- Data analysis function
- User-friendly software and installation
- OCV function
- Network compatible
- Lead-free enabled
Contact details: TK Lai, sales manager, Ph: +60-3-76882888, [email protected], www.omron.com
India distributor: Leaptech Corporation
________________________________________________________________________________________
Model: ALD 707 i3D Inline AOI, Brand: Aleader, Manufacturer: Aleader, Israel
Launched in January 2013, this AOI system is suitable in detecting all lifted leads and small packages (0402-01005). It has debug free and escape free technology which ensures fast reliable programming.
Key features
- Shadow free technology
- No warpage effect
- LED technology to inspect polarity, location and wire bonding components and other (connectors, pins, etc)
- Full OCV in actual production
- Full polarity check
- Inspections of all PCB’s colors including metal PCB’s green white black blue and others
- Process control (Including SPC) SW coming as standard on the machine. Offline programing repair station and barcode reading. No stopping the line for repetitive problems
- High Productivity, Low False calls rate down to 0-2 for 1000 components and with no escapes. Pre\Post reflow and wave soldering inspection
Contact details: Kobi Alfassi, product manager, Mob: +972-542-204-107, [email protected], www.ALeader-Europe.com
India distributor: Bergen Systems Pvt Ltd
________________________________________________________________________________________
Model: Zenith 3D AOI, Brand: Koh Young, Manufacturer: Koh Young, Korea
Launched in January 2013, the Zenith 3D AOI system measures the Z-axis profilometry of entire PCB assemblies, including components, leads and solder joints, based on the patented multi-frequency Moiré technology. Zenith is the only AOI system available that is measurement-based, and gives the user the ability to confirm—without any ambiguity—that their products meet IPC acceptability standards, that is, IPC-A-610. Zenith’s eight-way light projection and z-axis measurement provides true profilometry, eliminating false calls and escapes. Zenith identifies and flags all defects, and even features enhanced PCB war page compensation.
Key features
- Measures the true profilometric shape of components, solder joints, patterns and even foreign materials on assembled PCBs with true 3D measurement, overcoming the shortcomings of 2D AOI
- Identifies defects such as missing, offset, rotation, polarity, upside down, OCV, co-planarity, solder filet, lifted lead, billboarding, tombstone, bridging, etc
- Measurement-based inspection means that no ‘golden board’ is needed; results are compared directly to the IPC-A-610 reference.
- True 3D AOI ensures the ability to measure the height and shape of components and even shiny solder joints, and allows a true comparison with the IPC-A-610 standard for inspection
- Can handle PCB sizes up to 510 x 490 mm with L size or 810 x 610 with XL models
Contact details: Peter Shin, SEA regional manager, Ph: +65 6858-3292, [email protected], www.kohyoung.com
India distributor: NMTronics India Pvt Ltd
________________________________________________________________________________________
Model: 5K Spectro, Brand: Vi Technology, Manufacturer: Vi Technology, France
Launched in January 2013, the 5K series offers flexibility for wider board applications with its large board capability and small footprint, allowing the inspection of boards up to 53.34 cm x 60.96 cm.
The innovative and modular concept of the 5K series allows companies requiring entry-level or mid-range AOI systems to upgrade their equipment on-site to meet future requirements. The series has been designed with best-in-class hardware and software technologies to provide accuracy and repeatability, together with an excellent cycle time. It covers a large spectrum, from entry-level applications to the inspection of 01005 components and high-throughput zero-defect lines.
Key features
- Flexible and efficient solutions offering high-quality inspection with a maximised throughput
- Offers leading edge inspection technology and provides 100 per cent defect coverage at any location in the assembly line without affecting cycle time
- It is equipped with a spectro colour acquisition head, which offers a high-resolution and high-speed colour camera to inspect small components down to 01005
- A high-quality colour picture is available on the DefectViewer station to facilitate operator repair jobs
Contact details: Jean-Marc Peallat, president and CEO, Americas, Ph: +1-214-906-3061, [email protected]; William Tan, CEO, Asia Pacific, Ph: +65 6747 6550, [email protected], www.vitechnology.com
India distributor: iNETest Technologies India Pvt Ltd; India branch: Vi Technology
________________________________________________________________________________________
Model: Jade FP, Brand: Nordson DAGE, Manufacturer: Nordson DAGE, UK
Launched in April 2013, Jade FP X-ray inspection system provides superior X-ray image quality for all inspection applications. With its slogan ‘performance beyond expectations’, Jade FP offers the best value for money and the highest level of technology, image quality and ease of use.
Key features
- Open, transmissive X-ray tube; 0.95μm feature recognition tube
- 1.3 MP at 10fps long lifetime
- CMOS flat panel detector including real-time image enhancements
- Geometric magnification 1,200 X, system 3,100 X
- 736 x 580 mm maximum board size
- 65 degrees oblique views without loss of magnification
- High-quality real-time imaging
- 160kV 3W true sub-micron feature recognition
Contact details: Keith Bryant, sales and marketing director, Inspection Products, Ph: +44 1296 317800, Mob: +447770275927, [email protected], www.nordsondage.com
India distributors: iNETest Technologies India Pvt Ltd, International Marketing Corporation, Accurex Solutions Pvt Ltd
________________________________________________________________________________________
Model: SHS 60, Brand: Samsung, Manufacturer: Samsung, South Korea
Upgraded in January 2013, this solder paste inspection system has industry leading capabilities. It is a 3D solder paste inspection system, with most reliable and accurate 3D data. It has innovative 3D triangular sensor.
Key features
- Inspection speed: High speed 60 sq cm/sec
- Inspection speed: High resolution 30 sq cm/sec
- Authentic inspection and measurement with no false calls
- Laser triangulation method is applied which is least affected by environmental factors
- High inspection speed and accuracy by 3D sensor head with DSP chip
- Real-time SPC analysis program
- Board type, supported for all colours and all pad finishes
- Can detect maximum paste height of 1000 micron; Max. paste size of 20 x 20 mm; Min. paste size of 200 x 200 micron; Min. paste pitch of 150 micron; Max. board size of 390 x 260 mm; Min. board size of 50 x 50 mm; PCB load/unload time – 2sec/1.5sec; Board thickness of 0.4 to 4 mm
Contact details: Si hyun, Jang (Jayden), global SMT project manager, [email protected], www.samsung-smt.com
India office: Samsung C&T India
________________________________________________________________________________________
Model: OptiCon AdvancedLine, Brand: Goepel, Manufacturer: Goepel Electronic GmbH, Germany
Launched in November 2012, the OptiCon AdvancedLine AOI system offers a multitude of opportunities for inline integration into the production process. The system can be utilised at each position in a PCB production line. The AOI system utilises an orthogonal standard camera module for the inspection of SMD components and solder joints as well as THT/THR solder joints. As a supplement for maximum fault detection, the camera module ‘Chameleon’ with a patented 360 degrees angled-view inspection in
1 degree steps can be integrated. Add-on cameras for the inspection of THT components or microscopic resolutions (down to 3.2 µm) are available.
Key features
- Multispectral illumination, coaxial illumination, angled-view inspection (45 degrees) with the unique ‘Chameleon’ module to be adjusted in 1 degree steps
- The inspection modules in the AOI system can be configured in three speed levels according to the production process cycle times
- Various field-of-view sizes and different methods of image capture make the difference
Contact details: Alice Goepel, international sales manager, Ph: +49-3641-68960, [email protected], [email protected], www.goepel.com
India distributor: EMST Marketing Pvt Ltd
________________________________________________________________________________________
Model: Insignum 3000 scan (reading system), Brand: Insignum, Manufacturer: ASYS Germany
Launched in November, 2012, Insignum 3000 scan is a reading system, which consists of a stepper motor driven X/Y-axle-system with a scanner or camera. The product is transported on the conveyor and up against a stopper.
The scanner moves into position dependent upon the product, and scans the bar code or the data-matrix code, and transmits the information to the database or the network. After the scanning process, the product is transported to the following unit.
Key features
- PC controlled unit
- Database and network connections
- Two independent X/Y-scanner axles
- Product information is read from the previous marking unit
- Multiple scan positions per product are possible
- Automatic scanner positioning
Contact details: Parvindar Singh, managing director, ASYS Group, Ph: +65-6280-8887; Fax +65-6858 5005, [email protected], www.asys-group.com
India branch: ASYS Group India
India distributors: American Tec, DVS India and Innotronics Technologies Pvt Ltd
________________________________________________________________________________________
Model: BF-Planet-XII, Brand: SAKI, Manufacturer: SAKI Corporation, Japan
BF-Planet-XII was upgraded in August 2012. It is an in-line high-resolution and high-speed AOI system for M-sized boards. With a superior resolution of
10 µm and a scanning line colour CCD camera, the BF-Planet-XII provides accurate and stable inspection results. Solder fillets on components as small as the high-density mounted 0402 (01005) chip and ICs with 0.4mm pitch lead can be easily inspected and analysed.
Key features
- High speed
- A high resolution of 10 um
- High throughput: It takes only 9 seconds to capture an M-sized board (250 mm x 330 mm)
- Flexibility: Has 40mm clearance at the top side and 40 mm at the bottom side of the board, which enables the inspection of most PCBs with tall components. In addition, it can be used in any stage of the PCB production process—post-print, post-mounting, and post-flow/reflow or manual mounting.
- Traceability: Its optional function can read all types of bar codes and 2D code on the board. Inspection output is reported with the code number. It enables easy data handling and log data management on manufacturing lines.
- Inspection categories: Presence/absence, misalignment, tombstone, reverse, polarity, etc
- Compact body: 600 x 915 x 1270 mm
- Board size: 50 x 60-250 x 330 mm
- Board thickness: 0.6-3.2 mm
- Board warp: ±2 mm
Contact details: Kenji Nishida, ASEAN regional sales manager, Ph: +66-85210-7121, [email protected], www.sakicorp.com/en/
India distributors: DVS India Pvt Ltd, PCI Ltd and MR Technology
________________________________________________________________________________________
Model: BF-Comet18, Brand: SAKI, Manufacturer: SAKI Corporation, Japan
BF-Comet18 was last upgraded in August 2012. It is an offline inspection system suitable for M-sized board inspection. This model has an 18µm resolution and high-speed scanning hardware. Solder fillets on components as small as the high-density mounted 0603 (0201) chip, as well as ICs with 0.4mm pitch lead, are easily inspected and analysed. The BF-Comet18 has a newly designed LED lighting unit that enables the highest throughput of PCBA inspection.
Key features
- High productivity and compact body
- Resolution: 18 um
- High throughput: It takes only 7 seconds to capture M-sized boards (250 mm x 330 mm).
- Coaxial overhead light: Inspection is not
- affected by shadow created by tall components
- Flexibility: BF-Comet18 has a 40mm clearance at the top side and 60 mm at the bottom side of the board, which enables inspection of most of the PCBs with tall components. In addition, the BF-Comet18 can be used in any stage of the PCB production process—post-print, post-mounting and post-flow/reflow, or manual mounting.
- Compact body: 580 x 850 x 452 mm
- Board size: 50 x 50 – 250 x 330 mm
- Board thickness: 0.6 – 2.5 mm
- Board warp: ±2 mm
Contact details: Kenji Nishida, ASEAN regional sales manager, Ph: +66-85210-7121, [email protected], www.sakicorp.com/en/
India distributors: DVS India Pvt Ltd, PCI Ltd and MR Technology
________________________________________________________________________________________
Model: MV-9 series, Brand: Mirtec, Manufacturer: Mirtec, Korea
Launched in October 2012, the MV-9 series is a five-camera 2D/3D in-line AOI system, with a 15MP ISIS vision system. It operates on advanced six-phase colour lighting technology, with a 10 micron/pixel telecentric compound lens design. It has an integrated 10MP side viewer camera system, with a precision linear drive motor design.
Key features
- Exclusive omni vision 3D inspection technology
- Advanced digital multi-frequency quad Moire design
- Superior lifted lead detection for gull wing devices
- True co-planarity inspection of chips, BGAs and other aspects
- Height sensitive devices
- Three-stage high-speed conveyor system with programmable width control and automatic PCB support
- Advanced six-phase colour LED lighting system
- Pre-and-post reflow inspection capability
Contact details: David Bennett, president, Global Sales, Ph: +44-0-1752-696-695, [email protected], www.mirtec.com
India distributor: Accurex Solutions Pvt Ltd
________________________________________________________________________________________
Model: S3088 basic, Brand: Viscom, Manufacturer: Viscom AG, Germany
Upgraded in August 2012, the S3088 basic is the price-performance champion of the S3088 AOI family. It provides Viscom’s high-end inspection capabilities, including angular view cameras and OnDemandHR technology. Its plug-and-play concept is a perfect fit for OEMs and EMS providers who require an out-of-the-box system that boosts line-efficiency at a surprisingly low price.
Key features
- Highly-efficient pre- and post-reflow AOI
- Full high-end compatible inspection capability
- Cost-effective machine design
- Fast and easy programme creation and optimisation
- IPC-ready inspection
- Easy control of escapes and fail calls
- Intelligent line-integration
- Easy transfer of inspection programmes to other systems
- Economical price
- Orthogonal camera module 8 M (white LEDs), 4MP cameras, Resolution: 23.5 μm (standard), 11.75 μm (high) switchable with OnDemandHR
Contact details: Guido Bornemann, head of sales, Asia, Ph: +65-6285-9891, [email protected], www.viscom.com
________________________________________________________________________________________
Electronics Bazaar, South Asia’s No.1 Electronics B2B magazine
