TDK’s new CJA series of MLCC capacitors available in case size 0603 (EIA 0201) are designed for small mobile devices such as smartphones and decoupling applications in small modules. The devices show a 50 percent reduction in the mounting footprint compared to existing multilayer ceramic capacitors (MLCCs) of the same case size. This allows the number of components on a given surface to be doubled.
The TDK SRCT devices come with bottom terminals. A solder resist prevents wetting of the face and side areas of the MLCCs with solder. This allows high-density mounting as the clearance between mounted components is reduced to 50µm or less. The risk of short circuits due to contact with the solder is simultaneously excluded.
The device features a rated voltage of 6.3V, capacitance values of 0.1µF to 1µF. The new coating technology will be expanded to MLCCs of case size 0402 (EIA 01005) to provide additional space saving advantages.
