The funding will expand engineering teams and accelerate integrated chip development for industrial, automotive, and medical devices.
Sensesemi Technologies Pvt Ltd has raised ₹250 million in a seed funding round led by Piper Serica, as the fabless semiconductor start up moves to accelerate development of its edge-AI chips for industrial and medical applications.
The round also saw participation from LetsVenture Angel Fund, Sun Icon Ventures, MyAsiaVC, Whitepine Investments, Jain Oncor, and a group of angel investors. The company said the capital will be used to fund chip tape outs, develop reference designs, and expand its engineering team, while building partnerships with device manufacturers to speed commercial adoption.
Founded to address growing demand for high-performance edge computing, Sensesemi is developing integrated edge-AI chips that combine AI inferencing, wireless mesh connectivity, and precision analogue processing on a single platform. The chips are aimed at industrial IoT, automotive, and medical device markets, where real time processing, long battery life, and secure connectivity are critical.
Unlike conventional edge-AI solutions that rely on multiple discrete components, Sensesemi’s design integrates compute, connectivity, and sensing on one chip to reduce system complexity and power consumption. Founder and chief executive Vijay Muktamath said the approach allows customers to avoid trade-offs between performance, power efficiency, and security.
Alongside its digital designs, the company is developing an analogue AI inference processor to further lower power consumption in battery operated and implantable devices. Co founder and head of engineering Namit Varma said analogue domain inferencing could enable multi year battery life without sacrificing reliability.
Investors pointed to strong market tailwinds, with global edge-AI chip shipments expected to reach 5 to 7 billion units annually by 2030, driven by industrial and medical deployments.
