Hyderabad-based Moschip, a complete electronic engineering solution consulting company is setting up a new facility to make multi-layer printed circuit boards (PCBs) in the city. The unit will primarily serve the defence and medical companies in the US and other advanced markets.
MosChip chief executive officer Damodar Rao Gummadapu told an English daily in Telengana, “We will be investing $6 million (over Rs 38 crore) in this facility. The unit will come up in about 4-5 acres and the location is yet be finalised. We are currently evaluating options in the Fab City and are of the opinion that it should be closed to the airport as it will help in terms of logistics.”
“The facility will come up in the second quarter of 2018. India has very few multi-layer PCB manufacturing facilities and we will be making up to 30 layers. Of the $6 million investment that will go into the new facility, 50 per cent will be equity and the remaining 50 per cent will be debt,” he informed.
MosChip has recently set up an assembly unit for PCBs in Uppal with an investment of $1.5 million (Rs 13 crore). The company operates in total six facilities in the country, of which three are in Hyderabad, two in Pune and one in Bengaluru focusing on IoT, semiconductor systems and sub-systems, smart-metering and smart-lighting products and solutions.
The company has expertise in semiconductor, systems, IoT engineering from SoC (Systems on Chip), embedded systems design, cloud and mobile software development catering to the Aerospace & Defence, Consumer Electronics, Automotive, Medical, Telecommunications and Mobile industries. It serves over 400 clients from 140 countries.
By Baishakhi Dutta
