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- Korean government is pushing for new research and development projects
An MoU has been signed between Industry Ministry, Samsung Electronics, SK hynix and other chip firms for advanced semiconductor packaging.
The agreement ensures that the government and chipmakers will work together nurture companies in the final steps of semiconductor manufacturing.
The agreement was signed by the two Korean chip giants, as well as LG Chem, several outsourced semiconductor assembly and test firms and fabless companies.
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The Korean government is pushing for new research and development projects in the advanced packaging field and the system semiconductor sector to lead the global market.
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