Chandler, Arizona-based Everspin Technologies Inc, a global developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory technology, recently announced that the company has developed the engineering samples of its newest, high-density STT-MRAM, the EM128LX. The new product can support the Expanded SPI (xSPI) standard protocol and has a storage capacity of 128 Megabits, a twofold increase that of the previously announced 64Mbit EM064LX. The blend of expanded density with up to 233 megabytes/second of full read and write bandwidth signifies that the system designers now have the possibility of merging code and data memory on the same device, thereby reducing the cost, power, and area.
With the faster write speed and data persistence, the EM128LX is aimed at providing FPGA system designers with fast configuration, instant-on boot ability, and rapid updates of vital application features such as weighting tables in AI applications.
“We are pleased to offer our customers this new level of capacity and unprecedented writing speed. Everspin is leading the way in the ability to unify memory functions in one chip while maintaining ease of use for system designers,” said Sanjeev Aggarwal, President and CEO of Everspin Technologies.
“System designers using FPGAs will benefit from the fast configuration updates made possible with the write speed and density of this latest STT-MRAM offering,” said Allan Cantle, CEO of Nallasway Inc. “Getting to Octal xSPI and 128Mb capacity enables shorter development times for a wide range of commercial FPGA families.”
The EM128LX is currently available in two configuration types, a 24-ball BGA and 8-pin DFN. The latest JEDEC xSPI standard is predicted to become the most dominant way to reach data memory and code storage in embedded systems. Customer samplings are open for shipping now, and mass production samples of the EM128LX are expected to start as early as 2023.