The new 3nm chip process will offer 15 per cent performance boost alongside 30 per cent improved energy efficiency and will enter mass production late next year
Taiwan based semiconductor giant TSMC is likely to start its 4nm node to risk production in the third quarter of 2021, and 3nm node volume production during the second half of 2022. A report bi DigiTimes Asia notes that the new 3nm chip process will offer 15 per cent performance boost alongside 30 per cent improved energy efficiency and will enter mass production late next year.
“TSMC has claimed its N3 technology will be the world’s most advanced technology when it begins volume production in the second half of 2022. Relying on the proven FinFET transistor architecture for the best performance, power efficiency, and cost effectiveness, N3 will offer up to 15% speed gain or consume up to 30% less power than N5, and provide up to 70% logic density gain,” reads the report.
It is worth mentioning here that the world is facing a shortage of semiconductors at the moment. Several companies had halted production due to the same as well.
Apart from the 3nm process, TSMC has also begun the construction of the $12 billion chip fab at a site in the state of Arizona in the United States. It has also been reported that TSMC is also planning to build 5 fabs in the state, in addition to the one already in development, although it is yet to be confirmed by the company itself.
It is also rumored to formulating plans of building a semiconductor foundry in Japan. The Taiwan-based semiconductor giant might move ahead with the plan if the conditions between the United States and China continue to deteriorate. The new plant, as per the experts, is expected to use 12-inch wafers and produce 16-nm and 28-nm products. It might fabricate system semiconductors used in automobiles and smartphones. As a matter of fact, the shortage of these has been deepening in the world.
Days ago, it was also reported that about 20 Japanese companies, including electronic component maker Ibiden Co, will work with TSMC to develop chip manufacturing technology in Japan. TSMC, the world’s biggest contract chipmaker, intends to bear around half the project’s cost of about 37 billion yen ($337 million), the remaining half of which will be incurred by the Japanese government.
