- The company initiated the first phase of this production with a surface mount packaging line of 50 million devices that will be inaugurated on September 28th, 2023, by Rajeev Chandrasekhar, Union Minister of State for Electronics and Information Technology & Skill Development and Entrepreneurship.
CDIL Semiconductors (Continental Device India), India’s first semiconductor chips and components manufacturer, will add new semiconductor packaging lines via the Government of India and MeitY’s SPECS scheme.
CDIL aims to increase its annual capacity by 100 million units with the new lines. The company initiated the first phase of this production with a surface mount packaging line of 50 million devices that will be inaugurated on September 28th, 2023, by Rajeev Chandrasekhar, Union Minister of State for Electronics and Information Technology & Skill Development and Entrepreneurship.
Commenting on the expansion of the product lines, Prithvideep Singh, General Manager, CDIL Semiconductors, said, “In line with our steadfast commitment to innovation and market diversification, CDIL Semiconductors has strategically positioned itself to meet the burgeoning demands of the industry, especially the power electronics, automotive, and defence sectors, both within India and on a global scale. As we reflect upon this progress, we recognize that this is only the beginning. The groundwork has been established and will be a pivotal cornerstone for the company’s future endeavours.”
CDIL has established an advanced high reliability (HiRel) testing laboratory located at Mohali in addition to its NABL Accredited facility in Delhi. The HiRel laboratory is crucial to qualifying CDIL’s devices for stringent sectors like Automotive, Defence, and Aerospace.
