Sunday, September 14, 2014:
In 2014, ASM Assembly Systems launched two new placement machines for demanding applications in the areas of sub-module production and PCB embedding, as well as for placing super-small components. The SIPLACE engineers improved the linear measuring systems, the SIPLACE vision system, software and SIPLACE SpeedStar placement heads as well as the way they interact with each other for the new SIPLACE X4 S micron and SIPLACE X4i S micron models. These achieve placement accuracy ratings of up to +/-20 µm and speeds of up to 120,000 components per hour. While the SIPLACE X4 S micron places more emphasis on accuracy and, therefore, on new, highly demanding special applications like PCB embedding and SMT packaging, the SIPLACE X4i S micron delivers maximum speed for the efficient production of sub-modules for IT and telecommunication applications.
For further details: Ph: 080-40979029/40977816, [email protected], www.siplace.com
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Electronics Bazaar, South Asia’s No.1 Electronics B2B magazine
