Wednesday, August 20, 2014:
In April 2014, Omron launched a new inspection system using 3D measurements, called VT-S500, which is Omron’s solution to providing next-generation, 3D inspection capability at minimal cost. With good 3D image processing, the VT-S500 accurately analyses the topographical features of solder fillets to ensure PCB quality and reliability. Advanced software, capable of absorbing production inconsistencies and noise, creates adaptable and stable inspection programs. By minimising program teaching and tuning times, the VT-S500 greatly reduces the inspection costs traditionally associated with automated optical inspection (AOI). With ultra high-speed inspections and dual-lane availability, cycle times have reduced and productivity has increased. The VT-S500 is available with camera magnifications of 10 or 15 microns, and is capable of processing PCBs up to 510 mm×610 mm (in single-lane applications) or 510 mm×300 mm (in dual-lane applications).
For further details: Ph: 022-71288400, www.omron-ap.co.in
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