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Kaynes Semicon, 7 Rays Semiconductors Inks Pact To Enhance Chip Design And Packaging

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The partnership will deliver cutting-edge custom system-on-chip design solutions tailored to emerging technologies in various sectors.

Kaynes Semicon and 7 Rays Semiconductors are thrilled to announce a strategic collaboration to enhance the semiconductor value chain, focusing on innovative design and high-quality packaging. This partnership will empower Kaynes Semicon to leverage 7 Rays Semiconductors’ expertise in semiconductor packaging across various industries, specifically through outsourced semiconductor assembly and test (OSAT) solutions.

Together, they will deliver cutting-edge custom system-on-chip design solutions tailored for emerging technologies, effectively meeting the dynamic demands of sectors such as artificial intelligence (AI), telecom, automotive, computing, and the Internet of Things (IoT).

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In a recent media interaction, Sanjay Palsamudram, the chief executive of 7 Rays Semiconductors, emphasized that this partnership will prioritize building global market connections and enhancing supply chain resilience. He highlighted the collaboration’s focus on emerging sectors alongside consumer-driven markets, such as cloud storage, artificial intelligence (AI), Internet of Things (IoT), robotics, and advanced mechatronics. This strategic approach positions both companies at the forefront of innovation and industry demand.

As per media reports, a few months back, Kaynes Semicon partnered with Taiwan-based Recynergy Technology this year to transfer semiconductor manufacturing technology and supply chain knowledge from Taiwan to India. It has also entered into a collaboration agreement with Aptos Technology Inc., a subsidiary of Taiwan Mask Corporation. This partnership focuses on cooperation training in semiconductor packaging and testing technology and know-how authorization.

In September, the Union Cabinet approved establishing the fourth OSAT plant in India, granting Kaynes Semicon the green light for its chip assembly and packaging facility. This ambitious project entails an investment of Rs 3,307 crore in Sanand, Gujarat. Kaynes Semicon has acquired land in Gujarat and secured agreements with three international clients—LightSpeed Photonics from Singapore, a company based in the U.S., and another from Taiwan. This collaboration will see Kaynes manage assembly, testing, and packaging processes in India while the clients supply imported wafers. The company is concentrating on power electronics and industrial applications, aiming to drive innovation in these critical areas.

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