- Growing demand for smart devices and connected consumer goods has fueled substantial growth in 3D semiconductor packaging
- Fabrication of 3D IC relies on the utilisation of silicon on insulator wafers
The 3D semiconductor packaging market size was valued at USD 9.2 Billion in 2022 and is expected to reach a market size of USD 44.6 Billion by 2032 with a CAGR of 17.2%, shared a report by DataHorizzon Research.
The demand for higher networking equipment and storage capacity has made this growth possible. 3D semiconductor packaging with advanced technology is becoming increasingly popular. This technology includes several semiconductor technologies. The fabrication of 3D IC relies on the utilisation of silicon on insulator wafers, which effectively helps in reducing unwanted heat production.
3D technology is deemed highly effective as it can improve performance and efficiency by increasing bandwidth. Moreover, this approach can also significantly reduce the risk and cost of production, making it an invaluable solution for a wide range of applications.
The growing demand for smart devices and connected consumer goods has fueled a substantial 3D semiconductor packaging market expansion. This advanced approach entails stacking silicon wafers and vertically connecting them through Silicon Vias, enabling them to operate as a unified device with reduced power consumption compared to conventional methods. Leading industry players continually explore innovative packaging technologies to maintain a competitive edge in this rapidly evolving landscape.
The demand for 3D packaging is high in advanced applications like supercomputer chips, NAND, DRAMS, and microelectronic circuits. This technology helps to reduce the size of electronic devices like sensors, smartphones, and bio-medical solutions. A growing trend is the use of multi-chip packaging for ICs. Due to these benefits, the 3D semiconductor packaging market has a lot of potential for growth with a high growth rate.
